Comet Yxlon has launched the next-generation CA20 at SEMICON Europa, setting new standards for 3D X-ray inspection in advanced semiconductor packaging. Designed to integrate seamlessly into production lines, the CA20 is equipped with groundbreaking features, including a fully automatic loader and assisted defect recognition software, providing an unmatched level of efficiency, speed, and accuracy.
The CA20 brings the power of precise 3D X-ray inspection directly to high-volume production environments. Its automated loading capabilities and defect-recognition software enable consistent, high-speed imaging that supports the demands of advanced semiconductor packaging, a sector that requires meticulous quality control to ensure reliability and performance.
With the CA20, manufacturers now have access to a robust inspection tool designed specifically for modern production lines. The CA20’s automation features allow for continuous inspection with minimal human intervention, ensuring consistency and reducing the likelihood of error. The advanced defect recognition software further optimizes this process, quickly identifying flaws for more efficient quality control.
The launch of the CA20 underscores Comet Yxlon’s commitment to driving innovation in X-ray technology, offering solutions that address the challenges of today’s fast-evolving semiconductor industry.
For more information on the CA20 and Comet Yxlon’s full product lineup, visit https://yxlon.comet.tech/en/products/ca20-en
